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| B220/A - B260/A 2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER Features * * * * * * * * Schottky Barrier Chip Guard Ring Die Construction for Transient Protection Ideally Suited for Automatic Assembly Low Power Loss, High Efficiency Surge Overload Rating to 50A Peak For Use in Low Voltage, High Frequency Inverters, Free Wheeling, and Polarity Protection Application High Temperature Soldering: 260C/10 Second at Terminal Plastic Material - UL Flammability Classification 94V-0 SMA SMB Min 3.30 4.06 1.96 0.15 5.00 0.10 0.76 2.00 Max 3.94 4.57 2.21 0.31 5.59 0.20 1.52 2.62 B Dim A B C D E G H Min 2.29 4.00 1.27 0.15 4.80 0.10 0.76 2.01 Max 2.92 4.60 1.63 0.31 5.59 0.20 1.52 2.62 A C D J H Mechanical Data * * * * * * Case: Molded Plastic Terminals: Solder Plated Terminal - Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band or Cathode Notch Approx. Weight: SMA 0.064 grams SMB 0.093 grams Mounting Position: Any Marking: Type Number G E J All Dimensions in mm No Suffix Designates SMB Package "A" Suffix Designates SMA Package Maximum Ratings and Electrical Characteristics Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Rectified Output Current @ TT = 100C Non-Repetitive Peak Forward Surge Current, 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Forward Voltage Peak Reverse Current at Rated DC Blocking Voltage Typical Junction Capacitance (Note 2) Typical Thermal Resistance, Junction to Terminal Typical Thermal Resistance, Junction to Ambient (Note 1) Operating and Storage Temperature Range Notes: @ IF = 2.0A @ TA = 25C @ TA = 100C Symbol VRRM VRWM VR VR(RMS) IO IFSM VFM IRM Cj RqJT RqJA Tj, TSTG @ TA = 25C unless otherwise specified B220/A 20 14 B230/A 30 21 B240/A 40 28 2.0 50 B250/A 50 35 B260/A 60 42 Unit V V A A 0.50 0.5 20 200 20 25 -65 to +150 0.70 V mA pF K/W K/W C 1. Thermal Resistance: Junction to terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink. 2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC. DS13004 Rev. E-2 1 of 2 B220/A-B260/A IF, INSTANTANEOUS FORWARD CURRENT (A) 2.5 10 IO, AVERAGE FORWARD CURRENT (A) 2.0 B220 thru B240 B250 thru B260 1.0 1.5 1.0 0.1 0.5 TJ - 25C IF Pulse Width = 300 ms 0 25 50 75 100 125 150 0.01 0 0.2 0.4 0.6 0.8 1.0 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics 1000 Tj = 25C f = 1MHz TT, TERMINAL TEMPERATURE (C) Fig. 1 Forward Current Derating Curve 50 Single Half-Sine-Wave (JEDEC Method) IFSM, PEAK FWD SURGE CURRENT (A) 40 30 Cj, JUNCTION CAPACITANCE (pF) 100 20 10 0 1 10 100 10 0.1 1 10 100 NUMBER OF CYCLES AT 60 Hz Fig. 3 Max Non-Repetitive Peak Fwd Surge Current IR, INSTANTANEOUS REVERSE CURRENT (mA) 100 VR, REVERSE VOLTAGE (V) Fig. 4 Typical Junction Capacitance 10 Tj = 100C 1.0 Tj = 75C 0.1 0.01 Tj = 25C 0.001 0 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Fig. 5 Typical Reverse Characteristics DS13004 Rev. E-2 2 of 2 B220/A-B260/A |
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